CiteSeerX — Simultaneous double side …
configuration, drive and support systems, and control system), and process . double side grinding (SDSG) has a great potential to meet the demands for high.
Double Sided Grinding Method
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Double-sided surface grinding machine - …
Double-sided polishing process is a precise machining method for silicon wafers.It has the characteristics of the multi-directional motion,the complicated load and the tiny ...
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Patent US6726525 - Method and device for …
A double side grinding apparatus comprises a pair of grinding wheels (4), work rotating device (1) and moving device (2). The apparatus operates to bring the grinding ...
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Patent EP1193029A1 - Method and device …
We provide grinding and polishing tools, ... The length of contact arc is controlled by the grinding method as well as by the wheel ... double-sided surface grinding
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Grinding Basics | Grinding Support | …
Double/Single-Sided Polishing, ... Double-Sided Grinding & Polishing. ... Sydor Optics can achieve a greater economy of scale by using a batch-processing method.
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double sides grinder - Newest Crusher, …
A method for the simultaneous double-side grinding of a plurality of semiconductor wafers, involves a process wherein each semiconductor wafer lies such that it is ...
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Two-sided surface grinding method - Koyo …
Official Full-Text Paper (PDF): Effect of Double Sided Process Parameters in Lapping Silicon Wafer
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SIMULTANEOUS DOUBLE-SIDE GRINDING …
Simultaneous double side grinding of silicon wafers: a literature review. ... Double-sided simultaneous grinding method, double-sided simultaneous grinding machine, ...
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Patent US8197300 - Simultaneous double …
Advances in Abrasive Technology XIX: Experimental Research on Dressing Parameters of the Plate in Planetary Double-Sided Grinding Process
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Effect of Double Sided Process Parameters …
TY - CHAP. T1 - Effect of double sided process parameters in lapping silicon wafer. AU - Mahamad Sahab,Abdul Rahim. AU - Saad,Nor Hayati. AU - Rashid,Amirul Abd
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Research on the double-sided grinding and …
The grinding machine ... Double-sided surface grinding machine ... An independent claim is included for method for processing workpiece using grinding ...
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Research on the double-sided grinding and …
The present invention relates to a method sided polishing processing of a semiconductor wafer, the method at the same time by using the polishing pad with the fixed ...
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double sides grinder – Grinding Mill China
Fabrication of a double-sided micro-lens array by a glass molding technique. ... This paper has presented the fabrication of a double-sided MLA on soda lime glass ...
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Patent CN101927447A - Method of the double sided …
A double side grinding apparatus ... etc. of the double side grinding apparatus and the method of grinding work are not limited ... Double-sided grinding device ...
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Method for operating a double sided …
The invention relates to metal working and can be used in the automotive and bearing industries for double-sided grinding especially thin-walled parts.
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Two-sided surface grinding method and …
2016-8-14 · double sided fine grinding machine, ... Disc Grinding is a highly efficient grinding method that reduces premachining costs up to 50% and provides ...
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Double Sided Grinding/Polishing Machine - …
Simultaneous double-side grinding providing method for semiconductor wafer, involves machining semiconductor wafers in material-removing fashion between rotating ...
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Patent US5934983 - Double-side grinding …
The invention relates to a method of the double sided polishing of a semiconductor wafer. Semiconductor wafers are double sided polished by a method of polishing a frontside ...
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Patent US7815489 - Method for the …
2016-2-14 · More Details: double sided fine grinding machine, fine grinding wheels on Home Ore Grinder Equipment double ...
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Patente US8376811 - Method for the double …
1. A method for operating a double-sided grinding machine for grinding flat workpieces, with an upper and a lower work disk (16, 20), each of which has a ...
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Patent US20100144248 - Double-side …
1. A double-sided surface grinding machine (10), comprising two grinding disks (12, 22) and at least one work piece holder (16) that is driven in one plane ...
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Patent US5389579 - Method for single sided …
Semiconductor wafers are double sided polished by a method ... A method for the double sided polishing of a semiconductor wafer, ... Chemical mechanical grinding method
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Double-Sided Grinding, Lapping & Polishing …
Research on the double-sided grinding and polishing machine tool system
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Patent US20100330881 - Method For The …
Complete Patent Searching Database and Patent Data Analytics Services.
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Patent US8376811 - Method for the double …
In a double side simultaneous grinding method, ... The present invention relates to a double sided simultaneous grinding method for plate-like workpieces such as a ...
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Optimization Method for Double-sided …
Research on the double-sided grinding and polishing machine tool ... method for machining the blade ... designed double-sided grinding and polishing machine tool is ...
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US20100330881A1 - Method For The …
Semiconductor wafers are double sided polished by a method of polishing a frontside of the wafer in a first step with a polishing pad with fixed abrasive and ...
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KR101139054B1 - Method of the double …
Simultaneous double-side grinding providing method for semiconductor ... which was usually prepared before carrying out the double-sided simultaneous grinding, ...
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double side grinding machines – Grinding …
In this paper,the machining principles of double-sided grinding machine for sapphire substrate and its planetary transmission structure are introduced,and the …
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Double-sided surface grinding machine - …
Advances in Manufacturing and Mechanical Engineering: Effect of Double Sided Process Parameters in Lapping Silicon Wafer
